Product description
Fast cure at low temperature; good conductivity of heat。
Features
Technical parameters
- Typical Uncured
Properties - Filler
- Viscosity
- Thixotropic Index
- Work Life
- Storage Life
- EXBOND 3135C
- Silver
- 2W+CP
- >2.0
- >24hours
- 1year
- Test Description
-
- Brookfield CP51@5rpm, 25℃
- Viscosity@0.5 rpm /Viscosity@5 rpm
- 25℃，increase in viscosity 25%
- -40℃
- Cure process Data
- Recommend Cure condition
- Alternate Cure Condition
- EXBOND 3135C
- 60 minutes@80℃
- 60 minutes@80℃
- Physiochemical
Properties-Post Cure - Glass Transition Temperature (Tg)
- Coefficient of Thermal Expansion
- Weight Loss @ 300oC
- Coefficient of Thermal Conductivity
- Die Shear Strength
- EXBOND 3135C
- 84℃
- Below Tg 40 ppm/℃
Above Tg 140 ppm/℃ - 1.2%
- >2.0W/m?K
- 25℃ 12kgf/die
- Test Description
- TMA penetration mode
- TMA expansion mode
- TGA，RT～300℃
- Laser，121℃
- 2 mm×2 mm Si die
Ag/Cu on Ag LF
The data above indicate typical values only and are not intended to be used as specification limits.Bonotec products are packaged in syringes or jars per customer specification. Available package sizes range from 1cc to 30cc and 1 ounce to 1 pound. For details, refer to the Bonotec Standard Package Data Set or consult your Customer Service Representative.
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