Product description
It has been formulated for die attach application in high power LED and IC.It's excellent rheology avoids tailing or stringing problems in high throughput, automatic die attach equipment.
Features
Excellent thermal conductivity, electrical conductivity and reliability;
Good dispensability with minimal tailing and stringing;
High adhesion on various materials.
Technical parameters
- Typical Uncured
Properties - Filler
- Viscosity @25°C
- Thixotropic Index
- Work Life@25°C
- Storage Life@-40°C
- EXBOND 9300C
- Silver
- 1K+CP
- >5
- >24hours
- 1year
- Test Description
-
- Brookfield CP51@5rpm, 25℃
- Viscosity@0.5 rpm /Viscosity@5 rpm
- 25% increase in viscosity @RT
- N/A
- Cure process Data
- Recommend Cure condition
- Alternate Cure Condition
- EXBOND 9300C
- 3-5oC/min ramp to 150oC+2hrs @ 150oC
- 3-5oC/min ramp to 175oC+1hr @ 175oC
- Physiochemical
Properties-Post Cure - Ionics
- Glass Transition Temperature(Tg)
- Coefficient of Thermal Expansion
- Weight Loss @ 300oC
- Coefficient of Thermal
Conductivity - Volume Resistivity
- Die Shear Strength
- EXBOND 9300C
- Chloride 20ppm ,Sodium 10ppm Potassium 10ppm
- 120°C
- Below Tg 38 ppm/°C
Above Tg 125ppm/°C - 0.25%
- >20 W/ m·K
- <10-4Ω·cm
- 25℃ 15 kgf/die;200℃ 2.3 kgf/die;260℃ 1.1 kgf/die
- Test Description
- Teflon flask 5g sample / 20-40 mesh 50g DI water 100°C for 24hours
- TMA penetration mode
- TMA expansion mode
- TGA, RT~300℃
- Laser,121℃
- 4-point probe
- 2 mm×2 mm Si die
Ag/Cu on Ag LF
The data above indicate typical values only and are not intended to be used as specification limits.Bonotec products are packaged in syringes or jars per customer specification. Available package sizes range from 1cc to 30cc and 1 ounce to 1 pound. For details, refer to the Bonotec Standard Package Data Set or consult your Customer Service Representative.